发明名称 |
SCANNING SYSTEM FOR INSPECTING ANOMALIES ON SURFACES |
摘要 |
A high sensitivity and high throughput surface inspection system directs a focused beam of light (38) at a grazing angle towards the surface to be inspected (40). Relative motion is caused between the beam (38) and the surface (40) so that the beam (38) scans a scan path covering substantially the entire surface and light scattered along the path is collected for detecting anomalies. The scan path comprises a plurality of arrays of straight scan path segments. The focused beam of light (38) illuminates an area of the surface between 5-15 microns in width and this system is capable of inspecting in excess of about 40 wafers per hour for 150 millimeter diameter wafers (6-inch wafers), in excess of about 20 wafers per hour for 200 millimeter diameter wafers (8-inch wafers) and in excess of about 10 wafers per hour for 300 millimeter diameter wafers (12-inch wafers). |
申请公布号 |
WO9618093(A1) |
申请公布日期 |
1996.06.13 |
申请号 |
WO1995US16172 |
申请日期 |
1995.12.08 |
申请人 |
TENCOR INSTRUMENTS;NIKOONAHAD, MEHRDAD;STOKOWSKI, STANLEY, E. |
发明人 |
NIKOONAHAD, MEHRDAD;STOKOWSKI, STANLEY, E. |
分类号 |
G01B11/30;G01B11/02;G01N21/88;G01N21/94;G01N21/95;G01N21/956;G01R31/28;G01R31/308;G06T1/00;G06T7/00;H01L21/66 |
主分类号 |
G01B11/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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