Bond interface for joining partly metallised glass or ceramic substrate
摘要
Borosilicate or ceramic substrate (1) with partly metallised interface side (2) is bonded to a three-dimensionally structured Si substrate (4), oxidised (3) on the interface side. The interfaces are sepd. from one another in the edge region by formation of a wedge-like opening with predetermined profile, so that each surface of the metallisation layer is a predetermined min. distance from the oxide-free surface of the Si substrate.
申请公布号
DE4446703(A1)
申请公布日期
1996.06.13
申请号
DE19944446703
申请日期
1994.12.12
申请人
MANNESMANN AG, 40213 DUESSELDORF, DE
发明人
OBERMEIER, ERNST, PROF. DR.-ING., 14050 BERLIN, DE;HEIN, STEFAN, DIPL.-ING., 13409 BERLIN, DE;HOLZNER, KLAUS, DIPL.-ING., 13351 BERLIN, DE
