发明名称 Chip formed solid electrolyte capacitor
摘要 The capacitor has a porous anode element (31) of valve metal. It also has an oxide film layer (32) formed on the anode element (31). The cathode layer (34) is provided between the oxide layer (32) and the cathode layer (34). An outer anode electrode layer 937) is arranged on one of the ends surfaces of the anode element (31). An outer cathode electrode layer (36) is arranged on the other end surface of the electrode element and is electrically connected to the cathode layer (34). An outer packaging resin layer (38) covers a region where the outer anode electrode layer and the outer cathode electrode layer are not formed, so as to insulate both electrode layers from each other. One of the end surfaces of the anode element has a region (39) which is impregnated with an insulating resin, where the anode element is impregnated with electric insulation. The anode element and the outer anode electrode layer are electrically connected to each other in the region (39) impregnated with insulating resin.
申请公布号 DE19546393(A1) 申请公布日期 1996.06.13
申请号 DE1995146393 申请日期 1995.12.12
申请人 NEC CORP., TOKIO/TOKYO, JP 发明人 OHI, MASASHI, TOKYO/TOKIO, JP;TANIGUCHI, HIROMICHI, TOKYO/TOKIO, JP;KOBAYASHI, ATUSHI, TOKYO/TOKIO, JP
分类号 H01G9/012;H01G9/00;H01G9/004;(IPC1-7):H01G9/008;H01G9/025;H01G9/08 主分类号 H01G9/012
代理机构 代理人
主权项
地址