Workpieces (20) are laser-soldered by a method in which sections of solder (14.1) are cut up into one or several solder wires (14) by means of a cutter unit (11), the wires falling into openings (13.1) of workpiece holding-down clamps (13). The positions of the openings coincide with those locations on the workpieces which are to be soldered. The assembly is then fed to a laser soldering unit (10) for soldering. Pref. soldering takes place under protective gas, partic. N2 enriched with formic acid, and no flux is used.
申请公布号
DE4443822(A1)
申请公布日期
1996.06.13
申请号
DE19944443822
申请日期
1994.12.09
申请人
TEMIC TELEFUNKEN MICROELECTRONIC GMBH, 74072 HEILBRONN, DE