发明名称 Automatic laser soldering of workpieces
摘要 Workpieces (20) are laser-soldered by a method in which sections of solder (14.1) are cut up into one or several solder wires (14) by means of a cutter unit (11), the wires falling into openings (13.1) of workpiece holding-down clamps (13). The positions of the openings coincide with those locations on the workpieces which are to be soldered. The assembly is then fed to a laser soldering unit (10) for soldering. Pref. soldering takes place under protective gas, partic. N2 enriched with formic acid, and no flux is used.
申请公布号 DE4443822(A1) 申请公布日期 1996.06.13
申请号 DE19944443822 申请日期 1994.12.09
申请人 TEMIC TELEFUNKEN MICROELECTRONIC GMBH, 74072 HEILBRONN, DE 发明人 VAYHINGER, KAI-UWE, DIPL.-ING. (FH), 73269 HOCHDORF, DE;JUNG, WALTER, DIPL.-ING. (FH), 73035 GOEPPINGEN, DE
分类号 B23K1/005;B23K35/36;B23K35/38;(IPC1-7):B23K3/06;B23K26/00 主分类号 B23K1/005
代理机构 代理人
主权项
地址