| 摘要 |
<p>Apparatus for polishing the side of a thin, flat wafer (100) of a semiconductor material includes first (11) and second (31) polishing heads which each hold a wafer against a wetted polishing surface (12) and which each rotate and oscillate its respective wafer over the polishing surface. When the first polishing head (11) is moved away from the polishing surface (12) to clean, eject, and replace its wafer, the second polishing head (31) occupies a space over the polishing surface normally occupied by the first polishing head (11) so that the polishing surface (12) is used substantially continuously, and not intermittently.</p> |
