摘要 |
For constructing a modular transmitter having an array antenna, a module (10) contains antenna elements (14A, B, C, D) along the front edge of a base (18). RF circuitry (16A-16H) is provided on both the top and the bottom sides (20A, 20B) of the base (18). The base (18) contains heat pipes (301A-D, Fig. 3) to carry heat away from RF circuitry. The base (18) is made to be plugged into a mounting block (12) which provides electrical signals (58A-B, 60A-B) to the module (10) and acts as a sink for the heat removed by the heat pipes. Complementary recesses (64A-D, 66A-B, 69) and projections (62A-D, 67A-B, 68) provide keying vertically and horizontally between adjacent modules. RF power is passed through stripline structures (40, 42; 40B, 42B; 46, 48; 46B, 48B) utilizing the base (18) as bottom ground plane. Control signals are supplied from circuit boards (24, 24B) to the RF circuitry (16A-16H) by flexicables (32). <IMAGE> |
申请人 |
RAYTHEON CO., LEXINGTON, MASS., US |
发明人 |
TSUKII, TOSHIKAZU, SANTA BARBARA, CALIFORNIA, US;ALLARD, WILLIAM A., GOLETA, CALIFORNIA, US |