Solder flux for soldering flip-chip IC or electronic unit onto substrate, leaving no residue

摘要

A solder flux contains an organic cpd.with /- 2 OH gps., with a temp. at which the wt. change is 0% not lower than 170 deg C. and not lower than the linear solid phase temp. of a solder; measured by thermogravimetry at a flow rate of air or N2 gas atmos. of 200 ml/min. and rate of temp. increase of 10 deg C./min..