| 摘要 |
<p>In a photoelectric converter module, a chip carrier which carries a photoelectric converter chip on a side surface thereof is fixed on a metal base of the module via a metal member by means of welding, and the photoelectric converter chip is connected electrically with a pre-amplifier via a conductor pattern provided on a surface of the chip carrier and a bonding wire, so that parasitic capacities generated between the photoelectric converter chip and the pre-amplifier are considerably reduced, and the chip carrier is fixed firmly without causing deviation of an optical axis between the photoelectric converter chip and optical systems including a lens. <IMAGE></p> |
