| 摘要 |
PURPOSE:To improve yield of manufacture by applying solder flux of a specified film thickness to a semiconductor chip mount surface when carrying out flip- chip-bonding of a semiconductor chip on a substrate and by performing flip-chip- bonding by soldering surely. CONSTITUTION:Protecting films 5, 5' are formed on two opposite sides of a periphery of a semiconductor chip mount surface 4 on a surface of a substrate 3 whereon a semiconductor chip is mounted. A stamping pin 1 is formed to have a larger width than a semiconductor chip mount surface 4. A solder flux 2 is transcribed from a solder flux table to a bottom of the stamping pin 1. It is pressed toward the substrate 3. Thereby, a bottom of the stamping pin 1 is partially brought into contact with the protecting films 5, 5' and the solder flux 2 is applied onto the semiconductor chip mount surface 4 in approximately the same thickness as the protecting films 5, 5'. |
