| 摘要 |
PURPOSE:To enhance heat resistant impact reliability and moisture resistant reliability by sealing a semiconductor element with epoxy resin composition containing specific components. CONSTITUTION:In a semiconductor device, a semiconductor element is sealed by using epoxy resin composition containing components (A)-(C). (A) is epoxy resin, (B) is a reaction product obtained by preliminary reaction of silane compound represented by a formula I with phenolaralkyl resin represented by a formula (II); and (C) is one or both of organic phosphine compound and organic phosphonium. Thus, water absorbing rate of sealing resin is reduced to suppress absorption of moisture to the sealing resin, adhesive strength between the surface of the element and the sealing resin is enhanced to improve moisture resistance of a package itself and adhesive strength of the resin. |
