| 摘要 |
PURPOSE:To inspect an adherence of a lead frame to a semiconductor element with a brazing material in a step as early as possible and to stabilize the quality and manufacturing yield by applying pressure from opposite face to the face adhered with the element to the frame, plastically deforming the frame thereby to break the adhered part of the element or frame to the element, and inspecting the adherence of the element to the frame at the broken position. CONSTITUTION:After a semiconductor element 1 is adhered to a lead frame 3 with a brazing material 2, pressure 4 is applied by pressurizing means. In this case, a lead frame 3 is supported by a holding base 5. Pressure is applied from opposite side to the face adhered with the element 1 of the frame 3 to plastically deform the frame 3, thereby breaking the adhered part of the element 1 or the frame 3 to the element 1. If the brazing state of the frame 3 to the element 1 is good, the element 1 is broken after it is broken by the pressure. If the brazing state of the frame 3 to the element 1 is wrong, the element 1 is isolated from the material 2 after it is broken by the pressure. The area when the element is not broken but isolated is measured, and its area ratio and the stability of the product are performed. |
