Method for replacing chips

摘要

An electronic component and the surrounding fan-out wiring area (11) on the board (4) is mechanically removed. A preferred mechanical removal technique is micro milling. Subsequent to the removal a card module (20) placed and fixed on the board (4) at the location of said removed electronic component and said fan-out wiring area (11) such that the card module wiring matches with the board wiring. The card module (20), which has the same wiring layout like the wiring on the board before removal and on which a chip (9) is also directly attached, is placed in the wiring free region on the board. The fixing of the card module is accomplished by common bonding agents. After placing and fixing the card module the wiring of said board is electrically connected with the wiring of said card module. This can be accomplished by wire bonding (26) or tape automated bonding or other appropriate solder techniques. Further, a respective board and card module (20) for inserting into the recess (18) are disclosed.