| 摘要 |
<p>To provide a semiconductor device that has a highly reliable installation structure of the lead frames, the coupling protrusions thereof do not rattle in the coupling holes of the insulating case frame even if the dimensions of the elliptical coupling holes are only approximately controlled, the coupling protrusions (81c, 81c) are twisted in the opposite directions from one another by the angle of torsionθ. The head of each protrusion (81c) is widened to be elliptical. The lead frame (81) is installed with its coupling protrusions (81c, 81c) inserted in the elongated coupling holes (C) formed on the third step (16) of the resin frame portion (12). <IMAGE></p> |
