发明名称 Fabrication of integrated circuit having twin tubs
摘要 <p>A twin tub process is disclosed. After a thermal oxide is grown 21 over an already-formed p-tub 13, an n-tub 27 is formed by ion implantation. Then a layer of protective material 25, illustratively PETEOS, is formed over the oxides which cover the n-tub and p-tub. The protective layer of PETEOS helps to prevent ambient boron from contaminating the n-tub 27. Use of the protective PETEOS layer 25 permits the use of thinner thermal oxides over the tubs, thereby reducing the height difference at the tub boundary. &lt;IMAGE&gt;</p>
申请公布号 EP0716443(A1) 申请公布日期 1996.06.12
申请号 EP19950308767 申请日期 1995.12.05
申请人 AT&T CORP. 发明人 LEE, KUO-HUA;YU, CHEN-HUA DOUGLAS
分类号 H01L21/8238;H01L27/092;(IPC1-7):H01L21/77 主分类号 H01L21/8238
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