发明名称 |
Fabrication of integrated circuit having twin tubs |
摘要 |
<p>A twin tub process is disclosed. After a thermal oxide is grown 21 over an already-formed p-tub 13, an n-tub 27 is formed by ion implantation. Then a layer of protective material 25, illustratively PETEOS, is formed over the oxides which cover the n-tub and p-tub. The protective layer of PETEOS helps to prevent ambient boron from contaminating the n-tub 27. Use of the protective PETEOS layer 25 permits the use of thinner thermal oxides over the tubs, thereby reducing the height difference at the tub boundary. <IMAGE></p> |
申请公布号 |
EP0716443(A1) |
申请公布日期 |
1996.06.12 |
申请号 |
EP19950308767 |
申请日期 |
1995.12.05 |
申请人 |
AT&T CORP. |
发明人 |
LEE, KUO-HUA;YU, CHEN-HUA DOUGLAS |
分类号 |
H01L21/8238;H01L27/092;(IPC1-7):H01L21/77 |
主分类号 |
H01L21/8238 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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