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发明名称
BONDING GLASS COMPOSITION FOR ELECTRONIC PART
摘要
申请公布号
JPH08151230(A)
申请公布日期
1996.06.11
申请号
JP19940290761
申请日期
1994.11.25
申请人
SENYO GLASS KOGYO KK
发明人
KASHIWA YASUSUKE
分类号
C03C8/04;C03C3/066;C03C8/24;C03C17/34;(IPC1-7):C03C8/24
主分类号
C03C8/04
代理机构
代理人
主权项
地址
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