| 摘要 |
PURPOSE: To supply a wafer to a holding device by turning over the wafer while one surface is protected by providing a positioning member which comes into contact with the outer peripheral side-face of the wafer sent to the holding device from the lateral direction, centers the wafer to a prescribed position, and receives the wafer. CONSTITUTION: A suction arm 14 attracts and holds a wafer 12 by suction through a suction port 14b. An inverting mechanism turns the arm 14 by a prescribed angle. When the vacuum is canceled, the wafer 12 moves a very short distance by sliding on the attracting surface of the arm 14 and an arcuate receiving section 14c comes into contact with the outer peripheral side-face of the wafer 12 and receives the wafer 12. Then the arm 14 is further rotated and turns over the wafer 12 so that its polishing surface can come to the bottom side. After turning over, the wafer 12 is supplied to a position C by moving the arm 14 by means of a feeding mechanism and centered by means of the paired positioning members 22b of a centering mechanism 22. Then, after the mechanism 22 is lowered and the arm 14 is returned to a position B, a holding device 10 attracts the wafer 12 by suction. |
