| 摘要 |
PURPOSE: To provide a device and method for mounting solder ball by which a large number of bump forming solder balls can be collectively mounted on the electrodes of such a work as a chip, a board, etc., with high efficiency. CONSTITUTION: A large number of solder balls are picked up from a solder ball supply section by vacuum suction by lowering and raising a suction head 2 above the section 11. Then a flux contained in a flux supply section 40 is made to adhere to the picked up solder balls by again lowering and raising the head 2 after moving the head 2 to a position above the section 40. Thereafter, the solder balls are mounted on electrodes on a board 51 by lowering and raising the head 2 after moving the head 2 to a position above the board 51. A first line light source 38, second line light source 56, light emitting element 58, and light receiving element 59 are provided to the moving path of the head 2 so as to detect the occurrence of erroneous pickup, falling down, and erroneous mounting of the solder balls, etc. |
