| 摘要 |
PURPOSE: To obtain a die for manufacturing a resin-sealable semiconductor device which can prevent a defective appearance from generating by providing an adjustment means for adjusting the opening amount of an injection orifice, on the injection orifice for injecting a resin into the space of a mold. CONSTITUTION: Dies 11, 12 for manufacturing a resin-sealable semiconductor device are constituted of a movable gate 18 for adjusting the opening amount of a resin infection orifice 14, provided on the resin infection orifice for injecting a sealing resin 3 into a cavity 13. Consequently, it is possible to set the opening amount of the resin injection orifice 14 optionally. For example, if the opening amount is increased at the time of resin injection and the sealing resin 3 is semi-cured after resin injection, the opening amount can be lessened. Thus it is possible to control the thickness of a root part connected to the unnecessary part of the semiconductor device, which is formed from a track of an injection groove 15 projecting from the semiconductor device part. Thus the root part can be made thin. |
