| 摘要 |
PURPOSE: To provide a semiconductor wafer polishing device which can be set in a clean room and which is capable of discharging a semiconductor wafer to a following process by wafer carrier normally used in the clean room after washing and drying the semiconductor wafer after polishing without contaminating the clean room. CONSTITUTION: A polishing part 2 to polish a semiconductor wafer 4 by way of pressing the semiconductor wafer 4 on a turn table 3 while holding the semiconductor wafer 4 by a top ring 5 and a washing part 30 to wash the semiconductor wafer 4 are stored in a case body 1 having a side wall. A bulkhead 22 to separate the polishing part 2 and the washing part 30 is provided, a carrier mechanism to carry the semiconductor wafer 4 after polishing from the polishing part 2 to the washing part 30 through an opening 22a of the bulkhead 22 is provided, and exhaust systems 46, 47 to respectively independently exhaust from the polishing part 2 and the washing part 30 are provided. |
