| 摘要 |
PURPOSE: To realize defective junction elimination, improved alignment precision, visual confirmation of solder between a solder and a printed-wiring substrate side electrode, and to prevent package expansion due to evaporation of water content in the package as well as the defective package position due to explosion. CONSTITUTION: A metallic leads 8 externally protruding out of an exterior resin 6 are provided on a package. The alignment precision in the case of packaging is enhanced using the externally protruding parts 8 are used as the alignment target when using an automatic packaging machine. Since the external parts of exterior resin 6 of the leads 8 support the package during the packaging step, an LSI will not be tilted. Besides, due to the solder plating on the leads 8, the soldering during the packaging step can be visually confirmed. Furthermore, since the intruded part of the exterior resin 6 of the leads 8 externally releases the water content inside the evaporated package, the defective package due to the expansion and explosion of the package can be avoided.
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