Reactive hot-melt adhesive and/or sealing composition and method of using same

摘要

A reactive hot melt adhesive and/or sealing composition having a heat of crystallization in joules/gram of -2 or lower, comprising a curable heat-flowable adhesive material and a particulate filler, wherein said composition has a thermal conductivity of less than 0.30 W/m. DEG C. The invention also relates to a method of using the adhesive/sealer composition described herein to fill a cavity or recess in a substrate and the filled substrates formed thereby.