Resin forming compositions

摘要

Disclosed is an aromatic diamine compound represented by the formula (I) <IMAGE> (I) wherein R is H or CH3. Also disclosed is a bismaleimide compound represented by the formula (IV) <IMAGE> (IV) <IMAGE> wherein R is H or CH3, A resin forming composition comprising these compounds is also disclosed. The compounds are useful as raw materials for resins, and the resin forming composition and the resin can provide excellent heat resistance and impact resistance and low hygroscopicity.