| 摘要 |
PURPOSE: To prolong the life cycle of an inner circumferential edge and to enhance quality of a semiconductor wafer by blowing compressed air to the contact part of the semiconductor wafer with the tip part of the inner circumferential edge of an inner circumferential edge slicer. CONSTITUTION: Change of vertical deflection of an inner circumferential edge 1 is exchanged for an electric signal by a sensor 8. Pressure is regulated by pressure regulation valves 6, 7 with the electric signal as the origin. Compressed air of the regulated pressure value is blown on the upper and lower faces of the inner circumferential edge and the direction for sending cutting liquid is changed. |
