| 摘要 |
PURPOSE: To provide a polish method which carries out both final finish processing and cleaning of a polish surface simultaneously without using another independent cleaning device, and a polish device and a polish finishing device used for it. CONSTITUTION: A polish finishing part of a polish device is provided with a surface table 41 which rotates around a rotary shaft, a brush 42 which is planted in a surface of the surface table 41, an arm which holds a wafer W provided opposite to a surface of the surface table 41 and a supply part which supplies potassium hydride water solution to a surface of the surface table 41. A processing surface of a wafer W held by a tip part 11a of an arm is brought into contact with the brush 42 with a surface table rotating while potassium hydride water solution is supplied to a surface of the surface table 41 to polish a processing surface chemically mechanically and to remove a polish material attaching to a processing surface by the brush. |
