发明名称 Multi-layer EMI/RFI gasket shield
摘要 An multi-layered EMI gasket has a first layer constructed of an electrically conductive resilient material and a second, support layer of an electrically conductive material secured in facing engagement with the first layer. The material of the second layer is more rigid than the material of the first layer, so that the second layer imparts rigidity to the gasket. Preferably, the resilient material is carbon particle filled EPTFE and the support layer is a metal foil. The combination of these elements is very effective at conducting electrical signals, thereby providing exceptional EMI/RFI shielding of electronic components, while being far easier to handle and install than prior art gaskets. Further, the resilient material of the first layer permits the gasket to conform to irregular surfaces, thus providing an excellent environmental seal.
申请公布号 US5524908(A) 申请公布日期 1996.06.11
申请号 US19940306505 申请日期 1994.09.14
申请人 W. L. GORE & ASSOCIATES 发明人 REIS, BRADLEY E.
分类号 H05K9/00;(IPC1-7):F16J15/12 主分类号 H05K9/00
代理机构 代理人
主权项
地址