| 摘要 |
PURPOSE: To obtain a resin composition excellent in humidity resistance and flame retardancy and used for sealing a semiconductor by mixing an epoxy resin with a phenolic resin curing agent, a cure accelerator, a red phosphorus flame retardant, an ion scavenger and an inorganic filler. CONSTITUTION: This composition comprises an epoxy resin, a phenolic resin curing agent, a cure accelerator, a red phosphorus flame retardant, an ion scavenger and an inorganic filler. It is desirable that the red phosphorus flame retardant is one prepared by precoating the surface of red phosphorus with a phenolic resin or a mixture thereof with aluminum hydroxide. It is desirable that the content of the red phosphorus in the coated flame retardant is 60-95wt.%. When the content of the red phosphorus added is below 60wt.%, the flame ratardant needs to be added in a larger amount. When this content is above 95wt.%, the stability of the red phosphorus added is problematic. It is desirable that the red phosphorus flame retardant has a mean particle diameter of 10-70μm and a maximum particle diameter of 150μm or below.
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