BONDING APPARATUS, AND SUBSTRATE PRESSURE FIXING MECHANISM

摘要

PURPOSE: To provide a substrate pressure-fixing mechanism capable of always certainly pressure-fixing a substrate with a uniform pressure distribution over the entire pressure face even if bonding areas of the substrate are divided into very small sections corresponding to many pins of a semiconductor device to be produced. CONSTITUTION: A push member 176 to contact with and push a bonding area of a substrate L/F or a bonding stage 255 or only the member 176 is mounted on a support mechanism 101 tiltably in a plane contg. in the moving direction to and from the push member 176 and bonding stage 255. The mechanism 101 supports the member 176 and stage 255 so as to move one to the other relatively whereby the member 176 automatrcally profiles the surface of the bonding stage to closely contact with the substrate. The push member or bonding stage or only the push member is secured to four or two points on the support mechanism.