PACKAGE FOR SEMICONDUCTOR,申请号JP19940293239-传众专利搜索

首页产品黄页商标征信

会员服务注册登录

法人/股东/高管

发明名称	PACKAGE FOR SEMICONDUCTOR
摘要
申请公布号	JPH08153818(A)	申请公布日期	1996.06.11
申请号	JP19940293239	申请日期	1994.11.28
申请人	NEC CORP	发明人	SUGANO TOSHIHIKO
分类号	H01L23/04;H01L23/02;H03F3/60;(IPC1-7):H01L23/04	主分类号	H01L23/04
代理机构		代理人
主权项
地址

您可能感兴趣的专利

ARRANGEMENT FOR SEALING A PASSAGE BETWEEN A WALL AND A SHAFT

METHOD AND APPARATUS FOR THE COLLECTION AND THE DISPOSAL OF THE DEJECTIONS FROM PATIENTS CONFINED TO BED IN SANITARY INSTITUTES

OXYGEN DELIGNIFICATION OF MEDIUM CONSISTENCY PULP SLURRY

FIBRE TREATMENT DEVICE

APPARATUS FOR CHANGING POWER DIRECTION FOR BICYCLE

ADJUSTABLE STEERING ARRANGEMENT

AGRICULTURAL DRIP TAPE

A FLUORESCENCE-BASED SCREENING METHOD FOR IDENTIFYING LIGANDS

DEVICE FOR FILTERING AND SEPARATING FLOW MEDIA

TOILET CLEANING COMPOSITIONS

Swash-plate compressor capable of insuring sufficient lubrication between a piston and a shoe slidably interposed between the piston and a swash plate

FUEL INJECTION APPARATUS

Method of monitoring and controlling yield stress in rheologically plastic fluid

Optical scanner and optical scanning device, optical sensor, coded data reader, and POS system which employ the optical scanner.

Processing edit decision list data

Improvements in and relating to high tension insulators

HIV Intergrase inhibitors

AGENTS FOR PROMOTING BONE FORMATION