| 摘要 |
PURPOSE: To reduce the bonding pad pitch by a 2nd bonding to directly pressure- bond a wire to an inner lead after a 1st bonding to directly pressure-bond a wire having protrusions of very small lengths to an IC chip electrode. CONSTITUTION: Onto an inner lead 12 a bonding tool 13 is lowered for a 2nd bonding of a wire 11 and lifted up by a very small length, and clamps 14 are closed. When the tool 13 is moved horizontally in the extending direction of a wiring (1st bonding to 2nd bonding), a force is exerted on a bond part enough to cut the wire 11. The wire 11 has a protrusion 11a bent toward an IC chip electrode from the tool 13. The tool 13 is moved/lowered onto an IC chip electrode 16 formed on an IC chip 15 to thereby bond by an ultrasonic wave and load. The tool 13 is moved and lower onto the heated inner lead 12. |
