| 摘要 |
PURPOSE: To provide a photosensitive material also having various characteristics required for a printed circuit board. CONSTITUTION: This photo via hole forming photosensitive element consists of a transparent substrate and a photosensitive resin compsn. layer formed on the substrate. The photosensitive resin compsn. layer consists of 10-90 pts.wt. rubber, 5-40 pts.wt. phenol resin and 10-80 pts.wt. epoxy resin containing bromide epoxy resin based on total 100 pts.wt. of the mixture and contains 0.1 to 10 pts.wt. epoxy photopolymn, initiator and 0.1-10 pts.wt. aromatic polyazide compd. Thereby, a pattern can be formed with high accuracy in a simple process of deposition, exposure and development. Thus, a multilayered printed circuit board having enough adhesion strength of a copper coating formed by electroless plating and having flame-retardant property and high reliability can be produced. |
