PACKAGING METHOD OF SENSOR DEVICE

摘要

PURPOSE: To improve the package airtightness of a sensor while facilitating the selection of die bonding material when a sensor element is junctioned through the intermediary of the die bonding material. CONSTITUTION: A solder reflowed ceramic cap 3 is aligned on a ceramic substrate 1 whereon G sensor 5 is arranged through the intermediary of die bonding material 6 and then a heater tool 8 of a pulse heat mode thermal pressure fixing device is applied on the cap 3 to be power supplied in pressurized state and after heating for a few seconds forced cooling by air blow to be pressure- released later. Thus, a packaged G sensor is composed. At this time, almost no heat is conducted to the package due to the thermal pressure fixing by pulse heating mode thereby enabling the heat resistance of the die bonding material 6 to be neglected.