Interconnexion en trois dimensions de boîtiers de composants électroniques utilisant des circuits imprimés.

摘要

The packages (21) are arranged in rows and columns on each of a number of printed-circuit substrates (20) which are stacked together (33) and consolidated into a single structure by encapsulation in synthetic resin (30). Along the sides of each substrate a number of spacers (26) are constituted by e.g. small right circular cylinders of Cu which are soldered (like the packages) to metallisation on the substrate. The stack is terminated with an underlying printed-circuit substrate (31) and cut (23) vertically into columnar blocks (32), on whose sides the interpackage connections are metallised or engraved.