| 摘要 |
PURPOSE: To perform the visual inspection of IC chips in a short time without damaging the IC chips by casting the light on the entire chips as the IC chips remain contained in a tray. CONSTITUTION: IC chips 1, which are aligned in a perforated tray 2, undergo vacuum sucking by the same number of pipe-shaped collets 5 as the IC chips, and the chips are pushed by one time by a vertical driving part 6 and positioned. The entire surfaces of the positioned IC chips 1 are illuminated by a ring-shaped lighting part 7. The images are picked up by a microscope camera 8 from above, and an XYθtable 4 is driven. The same IC chips 1 are divided. The field of view of the of the camera is moved, and the inspection is performed.
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