发明名称 PACKAGE FOR CONTAINING SEMICONDUCTOR ELEMENT
摘要 PURPOSE: To provide a package for containing a semiconductor element, which can normally and stably operate a semiconductor element for a long term by effectively preventing the generation of noise with the change of a power supply voltage and a grounding voltage which are supplied to the semiconductor element. CONSTITUTION: This package for containing a semiconductor element comprises a recessed part 1a for containing a semiconductor element 3, an insulating board 1 having a plurality of metallized interconnection layers 5 to which the power supply electrode, the grounding electrode and the signal electrode of the semiconductor element 3 are connected and the one end of which is led out to the outer surface, a plurality of connection pads 7 which covers the surface of the insulating board 1 and brought into contact with the respective metallized interconnection layers 5 and a plurality of external lead pins 8 fitted to each of the connection pads 7. Therefore, the area of the connection pads 7 brought into contact with the metallized interconnection layers 5 connected to the power supply electrode and the grounding electrode of the semiconductor element 3 is made larger than that of the connection pads 7 brought into contact with the metallized interconnection layers 5 connected to the signal electrode.
申请公布号 JPH08148604(A) 申请公布日期 1996.06.07
申请号 JP19940287835 申请日期 1994.11.22
申请人 KYOCERA CORP 发明人 TOMITA MINORU
分类号 H01L23/12;H01L23/15 主分类号 H01L23/12
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