| 摘要 |
PURPOSE: To provide a method of manufacturing a semiconductor device proper to form a via hole for easily attaching a conductor layer uniformly to the via hole in a substantially bowl shape. CONSTITUTION: A photosensitive resin 3 is mounted on a substrate 1 so that thickness, in which the thickness is removed by the grinding of the photosensitive resin 3 in a post-process is added to final required thickness as an insulating layer, is obtained. A cavity is formed to the photosensitive resin 3 by a specified pattern by exposure, development and etching, and the photosensitive resin 3, to which the cavity if formed, is thermoset. When a photosetting layer 6a show by a dotted line and a part of a thermosetting layer 3a in Fig. are ground and removed, a via hole 9 having a substantially bowl shape is formed. |
