| 摘要 |
<p>PURPOSE: To provide a three-terminal type semiconductor device being excellent electrically and capable of improving yield by making electrical connection more reliable between a second and a third lead terminals and electrode portion. CONSTITUTION: Provided are a semiconductor chip, two electrodes 1 and 2 formed in the longitudinal direction on the top surface of the semiconductor chip 3, a first lead terminal 4 connected to the lower surface of the semiconductor chip, and a second lead terminal 5 and a third lead terminal 6 with the tip portions connected to the electrodes and with extending portions in extending directions from a connecting portion to the electrodes, the first lead terminal 4 being projected out from one of both the sides. Also from other side, the second lead terminal 5 and the third lead terminal 6 are projected out, and a mold portion 7 covering the semiconductor chip 3 is also provided in this semiconductor device. The second lead terminal and third lead terminal have the width at each tip larger than the width of the semiconductor chip in a short side direction at the connection portions with the electrodes.</p> |
