| 摘要 |
PURPOSE: To provide a new manufacturing method for lead frame capable of performing fine patterning and reducing costs easily, of preventing deformation of leads in production process and of easily plating the leads as required. CONSTITUTION: A lead 3 is formed on the surface of a lead forming substrate 2 through an etching stop film 3, a hole 8 is formed by selective etching on both the surfaces of the substrate 2, a portion corresponding to a lead forming region of the lead-forming substrate 2 is made thinner, a lead holding film 10 having a device hole 11 and an outer lead bonding slit 12 is adhered to the surface of the lead forming substrate 2, a thinned portion 9 corresponding to a lead forming region of the lead forming substrate 2 is removed by selective etching from the rear surface, and an etching stop film 4 is removed by etching. |
