| 摘要 |
PURPOSE: To obtain a semiconductor device in which short shot is suppressed at the time of molding a package body. CONSTITUTION: The semiconductor device embedded with a heat plate 2 for dissipating the heat from a semiconductor element 1 in a resin molded package body 6 is provided, in the heat plate 2, with a small hole 2a (or a notch) allowing the molding resin to flow through at the time of molding the package body 6. Preferably, the small hole 2a is provided in the region opposite to a resin injection port (gate) 7. |
