| 摘要 |
PURPOSE: To provide a protective tape which protects the surface of a substrate by adhering thereon when its backside is ground and can be exfoliated giving no damage to the substrate, and also to provide the grinding method with which the backside of the substrate can be ground using the above-mentioned protective tape. CONSTITUTION: After a wafer 14, having a pattern-formed layer 12 on the surface, has been received as shown in (a), a substrate surface protecting tape 16, consisting of a polyvinyl acetate thermoplastic bonding agent, for example, is adhered to the surface of the wafer 14 as shown in (b). Then, the backside of the wafer 14 is ground by a grinding device as shown in (c). Subsequently, the wafer 14 is dipped into a washing bath containing IPA, the protective tape 16 on the surface of the substrate is dissolved, and it is dissociated from the substrate as shown in (d). |
