发明名称 INTERLAYER ELECTRIC INSULATOR FOR MULTILAYERED PRINTED WIRING BOARD
摘要 PURPOSE: To obtain an interlayer electric insulation coating film excellent in adhesion to copper plating which forms a circuit, in a multilayered printed board obtained by a build-up method. CONSTITUTION: Conjugated diene based polymer (e.g. copolymer of polybutadiene and acrylic acid) suspends a carboxyl group in a molecular chain. Rubber denatured epoxy acrylate resin is obtained by making conjugated diene based polymer, bisphenol A-type epoxy resin and acrylic acid. Acid pendant rubber denatured epoxy acrylate resin (A) has a structure by reacting hydroxyl group of rubber denatured epoxy acrylate resin with polybasic acid anhydride. The following are contained: the resin (A). diluent (B), photopolymerization initiator (C), and epoxy resin (D).
申请公布号 JPH08148837(A) 申请公布日期 1996.06.07
申请号 JP19940281885 申请日期 1994.11.16
申请人 DAINIPPON INK & CHEM INC 发明人 KITAZAWA SEIICHI
分类号 C08G59/14;C08F290/14;C08G59/40;H01B3/40;H05K3/38;H05K3/46;(IPC1-7):H05K3/46 主分类号 C08G59/14
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