| 摘要 |
<p>PURPOSE: To enhance the bondability of power supply plates, such as a power supply layer and a ground layer, and thereby to improve yield and reliability. CONSTITUTION: The surface of a ground layer, stuck to a lead frame 1 using adhesive 4, is subjected to silver plating 2. Of leads 7 positioned in proximity to the circumference of the ground layer 3, at least those 9 to be wire bonded to the ground layer 3 are also subjected to the same silver plating 13 as in the tips of the inner leads 8 are subjected (11).</p> |
