| 摘要 |
PURPOSE: To improve the reliability by connecting an electrode portion to a second lead terminal and a third lead terminal respectively through a frame and by reducing defects such as electrical short-circuits between lead terminals. CONSTITUTION: Provided are a semiconductor chip 3 having electrode portions 1 and 2 of projected shape on the top surface, a first lead terminal 4 connected to the bottom surface of the semiconductor chip 3, and second and third lead terminals 5 and 6 arranged oppositely to the first lead terminal 4. Electrical connections are made through frames 7 and 8 respectively specially between the electrode portion 1 and the second lead terminal 5 and between electrode portion 2 and the third lead terminal 6. Also, the semiconductor chip 3 and its vicinity are covered with a mold portion 9 made of epoxy resin. By connecting separately between two electrode portions 1 and 2 and the second and third lead terminals 5 and 6 through frames 7 and 8, defects such as electrical short-circuits between the second and third lead terminals 5 and 6 can be reduced thereby greatly enhancing the reliability. |
