| 摘要 |
PURPOSE: To provide a multilayered printed wiring board, which solves difficult points in a conventional technique, improves heat resistance of an insulating bonding layer, and enables decreasing of permittivity and thinning of a layer, and to improve workability. CONSTITUTION: In a multilayered printed wiring board, inner layer substrates and insulating bonding layers are alternately laminated and bonded, and polycarbodiimide resin is used as the insulating bonding layers. In a manufacturing method of the multilayered printed wiring board, after inner layer substrates and insulating bonding layers are alternately laminated and bonded by using polycarbodiimide resin, continuity is obtained between the inner layer substrates. |
