| 摘要 |
PURPOSE: To reduce a roughing process, provide a printed wiring board of low cost, and enable manufacturing under safe working circumstances without using strong oxidizing agent like chromic acid, by collectively performing photo- viahole forming and surface roughing, in a manufacturing method of a high density build-up printed wiring board. CONSTITUTION: A manufacturing method of a printed wiring board consists of the following: a process wherein an insulating layer 3 is formed by using adhesive agent wherein fine powder 4 of optically modified resin is compounded in ultraviolet rays curing resin which is excellent in heat resistance and not yet cured, a process wherein a recessed part from which a photo-viahole 6 and the fine powder 4 of the optically modified resin are eliminated is formed by developing and etching after ultraviolet rays treatment of a specified position, and a process wherein a conducting layer constituted of a plating film is formed on the insulating layer 3. |
