| 摘要 |
PURPOSE: To obtain a metal base multilayer circuit board excellent in heat dissipation and dielectric strength by bonding a circuit board to a metal plate through an insulating adhesive sheet contg. a metal oxide and/or metal nitride. CONSTITUTION: A circuit board composed of metal layers 3 and 4 bonded through an insulating adhesive layer 5 is bonded to a metal plate 1 through an insulating adhesive layer 2, resulting in a unified structure. The layer 2 is composed of a metal oxide and/or metal nitride and resin and has a thermal conductivity of 35×10<-4> -150×10<-4> cal/cmsec deg.C and thickness of 20-200μm. Thus, a metal base multilayer circuit board excellent in noise shield and dielectric strength and heat dissipation can be obtained. A high-reliability module can be easily obtained, using it. |
