| 摘要 |
PURPOSE: To omit oxidizing of a copper foil surface, by spreading undercoat material on both surfaces of a both-sided copper clad board whose material has, as the inevitable components, epoxy resin having two or more epoxy groups in a molecule and sulfur containing hardner having functional groups reacting with epoxy groups, and lamination-molding prepreg impregnated with thermosetting resin on both surfaces. CONSTITUTION: On both surfaces of a both-sided copper clad laminate which is circuit-worked and is not oxidized, prepreg which is impregnated with thermosetting resin and dried are stacked to manufacture a multilayered printed wiring board. Undercoat material whose inevitable components are epoxy resin having two or more epoxy groups in a molecule and sulfur containing hardner having functional groups reacting with epoxy groups is spread on both surface of the both-sided copper clad laminate. The copper foil step-difference of the inner layer circuit board is reduced, and prepregs impregnated with thermosetting resin are stacked on both surfaces and lamination-molded. Grindine derivative is used together with the sulfur containing hardner as the hardner of the undercoat material. Thereby the oxidizing of the copper foil surface is made unnecessary. |
