| 摘要 |
PURPOSE: To provide a surface mounting type semiconductor module having a small size, light weight and low cost which further has a high reliability and high heat radiating quality. CONSTITUTION: In a semiconductor module 10, a module board 11, a semiconductor element mounted on the surface of the module board 11, and a cap 13 covering the surface of the module board 11 which mounts the semiconductor element are provided respectively. In the two sets of the paired opposite side surfaces of the module board 11, the cap 13 has four protruding parts 14 each of which is so formed that its end part exceeds the rear surface of the module board 11. |
