发明名称 STRUCTURE AND METHOD FOR EXPOSING PHOTORESIST
摘要 <p>A structure for patterning a polysilicon layer includes a TiN layer located above an amorphous silicon (a-Si) layer forming a TiN/a-Si stack. The TiN/a-Si stack is located above the polysilicon layer. The TiN layer serves as an ARC to reduce overexposure of the photoresist used to pattern the polysilicon layer, while the a-Si layer prevents contamination of the layer below the polysilicon layer.</p>
申请公布号 WO1996017376(A1) 申请公布日期 1996.06.06
申请号 US1995015260 申请日期 1995.11.22
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