| 摘要 |
The object of the invention is a device for the protection ("hardening") of a component or of an electronic circuit which is integrated with the support of the component, from the interference (voltages) generated by an external electromagnetic field, for example the effect of the EMP wave. In one embodiment, the connections 2 of the component (C) to be protected are connected to each other by a sandwich type structure including a first layer (V 1 ) of varistor material, a first electrode (7) connected to a given potential (P), a second layer (V 2 ) of varistor material and a second electrode (8) connected to ground. The arrangement ensures a low capacitance, enabling a very rapid response to potential build-up due to an EMP. |
