发明名称 INSPECTION METHOD OF SOLDERING AND OF VACANCY AND SLIP-OFF OF LEAD
摘要 PURPOSE: To enable systematic, quick and accurate inspection of a vacancy and slip-off of a lead by a method wherein a soldered part is illuminated with all illumination patterns necessary for a plurality of inspection items, images thereof are picked up and judgement of the quality is made in the sequence of the inspection items registered beforehand. CONSTITUTION: When inspection of soldering is started, an illumination controller 16 switches power sources 10 of an illuminating part 5 on the basis of illumination patterns registered beforehand and thereby sets upper illumination, lower illumination, all-stage illumination and angle illumination. A soldered part 3 is illuminated properly in accordance with the contents of inspection and an image of the soldered part 3 is picked up in each condition of illumination by a TV camera 4 and stored in an image memory 14. CPU 15 executes inspection of a vacancy (a tunnel or a blow hole), slip-off of a lead, bridging and others sequentially for each land 9 on the basis of inspection items, an execution sequence, quality determination steps, reference data, a form of packaging, etc., registered in an image processing part 17 and a teaching table 18, confirms completion of inspection of all lands 9 and ends the inspection of soldering.
申请公布号 JPH08145903(A) 申请公布日期 1996.06.07
申请号 JP19940309456 申请日期 1994.11.21
申请人 MATSUSHITA ELECTRIC WORKS LTD;NIPPEI TOYAMA CORP 发明人 NAKAGAWA MASAYUKI;NUMATA MUNETOSHI
分类号 G01B11/24;G01N21/88;G01N21/93;G01N21/956;G06T1/00;G06T7/00;H05K3/34 主分类号 G01B11/24
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